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    Spray Developing Machine

    WH-PXY-01 type developing machine is a small automatic spray developing machine for laboratory use, suitable for 3-5 inch substrate, liquid volume range 10-500ml, maximum speed 400RPM, maximum development time 900s

    1. description

    1. Product introduction

    The spray developing machine (WH-PXY-01) is a product independently developed by Wenhao Co., Ltd. with independent intellectual property rights. It is designed and developed for the development process in the photolithography process and can be used for silicon wafers with specifications below 5 inches. Carry out program-controlled automatic development. This equipment can completely replace the manual development link in the production process of microfluidic chips, and overcome the uncontrollable amount of developer added in the manual development process, uncontrollable silicon wafer development time, and uncontrollable development effect between silicon wafers of the same specification. It reduces the development quality problems caused by the operator's human factors and the damage of the silicon wafer.

    2. Technical parameters

    Speed: 0~400RPM

    Liquid volume control: 10~500mL

    Adaptable silicon wafer/chip: 3 inches, 4 inches, 5 inches

    Developing time: 0~900s

    Inlet speed: 0~100%

    Power input: AC220V±10V/50HZ

    Power: 100W

    Weight: 20 kg

    Dimensions: 410 (W) * 410 (D) * 350 (H) mm

    Working environment: temperature 0℃-40 ℃, relative humidity<80%

    Spray Developing Machine

    Spray Developing Machin