Reactive Ion Etching equipment

       The RIE 2000/3000 is a turbo pumped system capable of reaching a base pressure of less than 10-6 torr. This low base pressure provides a clean etch environment and highly anisotropic etch without undercutting by eliminating residual species within the chamber prior to starting the etch process. The RIE-2000 model include as standard a two channel precision needle valve gas control and separate vent to atmosphere line. In replacement of the needle valve set up, the RIE-2000 can be equipped with up to two mass flow controller channels for accurate ratio of two species. The RIE-3000 can be equipped with up to five mass flow controller channels and in this case, the MFC controls are mounted into a stand alone cabinet connected to the main system. The RIE-3000 can ratio four process gas species to one species, if needed, or control the flows of each species independently. The rotational speed of the turbo pump can be controlled in order to set a precise pressure with the set mass flows.

       Model RIE2000/3000

• 200 watt RF Generator and manual matching network
• Dual digital readout of forward and reflected power
• Dual gas controls - (only on RIE2000)
• Separate vent control
• Stainless Steel Chamber
• DC bias meter display
• Digital termination timer
• 6” water cooled sample stage
• Turbo pump
• Corrosive series rotary vane roughing pump
• Capactiance manometer
• Stainless steel gas distribution ring
• Instruction manual
• Quad Channel Power Supply/Readout (only on RIE3000)
• Mass Flow Controller (only on RIE3000)